Researchers at the University of California, Merced, have engineered a material modeled after corn starch, exhibiting adaptive durability and conductivity under rapid impacts.
Through the fusion of specific polymers, they crafted a film that strengthens upon impact, making it ideal for electronic wearables, sensors, and personalized prosthetics. Inspired by corn starch, this engineered film showcases adaptive characteristics that could redefine the capabilities of electronic devices, shaping a new era of resilient and high-performance innovations.
The innovative material’s ability to toughen under rapid impacts promises resilient electronic wearables, sensors, and personalized prosthetics, offering durability and versatility for future advancements in technology and healthcare.